To ensure semiconductor longevity with power application in the order of several hundred watts per device, each element of thermal impedance must be carefully considered. Chemax HEAT SINK COMPOUND is developed to reduce the high thermal impedance of air gaps otherwise present between the mating surfaces of the semiconductor case and the heat sink. This grease like compound fills the minute air gaps between the mating surfaces thereby reducing the thermal impedance. It is applied to the base and mounting studs of transistors and diodes.

Withstands temperature up to 250*C.

Packing Size

1-KG & 10-KG

Applications

Semiconductor devices and heat sinks. Thermoelectric modules and heat sinks. Power resistors and chassis. Thermostats and mounting surface. Thermistors and mountings. Any two parts which must be coupled thermally.

Benefits

• Excellent thermal conductivity for dissipating heat.
• Very good electrical insulating property.
• Non dripping & non-melting.